How to strengthen the PC endurance plate hot bending process? PC endurance plate pressure synthesis shape is based on the thermoplastic characteristics of PC endurance plate, heating it to a certain temperature, softening after plastic deformation processing technology. Endurance plate can be hot bending, can also be cold drawn, but because of cold drawing only carry out parallel line bending such a simple solution.

The thermal deformation temperature of PC endurance plate is about 130 ° C, and the glass transition temperature is about 150 ° C, which is higher than this temperature, the plate can carry out thermal forming. Heating plate machine equipment generally through two ways, one is the heating wire, the PC endurance plate can be heated along a parallel line, the PC endurance plate to bend the position suspended in the air frame on the heating wire, after heating to soften, bending along this heating softening parallel line.

There is also an electric oven - the electric oven heating bending is to make the PC endurance plate tablet computer bevelled transformation, first put the PC endurance plate tablet computer into the electric oven, in the electric oven overall heating for a period of time, after softening, the softened a whole piece of PC endurance plate is taken off, put into the mother mold shell in advance, then press with the male mold shell, and so on, the plate is removed after cooling. We're in full shape now.

Whether it is the use of heating wire or electric oven to carry out the production and processing of PC endurance plate, in many cases there will be bubbles in the bending position, white and other conditions, light harm beautiful and generous, heavy all damage, resulting in a continuous rise in the loss rate. The foam caused by the plate is generally due to two reasons, respectively, the heating temperature and the environmental humidity of the plate.

Therefore, PC endurance plate bending generally needs to be carried out by experienced technical professionals. In order to prevent the abnormal phenomenon caused by water, so before heating forming, the plate should be carried out for a period of time with a lower temperature, generally can be set at 110 ° C ~120 ° C to remove water, water removal temperature can not be higher than 130 ° C to avoid softening of the plate. The delay time for removing water depends on the moisture composition of the plate, the thickness of the plate and the dry temperature used.

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